Technologies

Ferroelectrics (FE)

Ferroelectics Technologies Measurement Software Components Projekte Veröffentlichungen

Processing techniques

BST substrate realization (available for the FE group by cooperation partners)

  • Screen-printing on Al2O3 substrates for BST thick-films, sintering in a tube or microwave oven, alternatively also sintering of BST dense bulk ceramics.
  • RF-Sputtering for BST thin-films
  • PLD for BST thin-films
  • Under research: new process­ing techniques for structured BST films having an adjustable of thickness 100nm … >2µm
BST thin-film on a Si/SiO2/Pt substrate.
BST thin-film on a Si/SiO2/Pt substrate.
BST thick-film on an Al2O3 ceramic of 2inch
BST thick-film on an Al2O3 ceramic of 2inch

Processing techniques for device realization on BST substrates and their integration (digest)

  • Thermal evaporation of gold, chrome and nickel
  • E-Beam evaporation of platinum, titanium, indium tin, …
  • Electroplating of high conductive RF electrodes
  • Lithography based on Cr-masks for planar structuring
  • Reactive ion etching (RIE) for thin-film structuring
  • Wire bonding
  • Dicing
  • Polymer / organic based passivation of BST films and devices (by cooperation partners)
  • Ball bumping (by cooperation partners)
  • * Flip-chip mounting (by cooperation partners)
Realization of metal electrodes for planar RF components
Realization of metal electrodes for planar RF components