Standort: S3|06 122

• Alcatel Sputtering machine
• DC/HF with RF bias
• HF-Sputter etcher
• 4x Cathodes
• 4x 4" Wafers
• Materials: Al, Cr, Cu, Ni, AlSi, SiO2
• Deposition rate: 100 – 1000 nm/min

https://www.tuinfra.tu-darmstadt.de/