ETIT Clean Room

Sputtering machine Alcatel

Location S3|06 122

  • Alcatel Sputtering machine
  • DC/HF with RF bias
  • HF-Sputter etcher
  • 4x Cathodes
  • 4x 4" Wafers
  • Materials: Al, Cr, Cu, Ni, AlSi, SiO2
  • Deposition rate: 100 – 1000 nm/min

https://www.tuinfra.tu-darmstadt.de/