ETIT Clean Room

PECVD – ICP and End Point Detector with Ar, Methane, Helium, N2, Silane, Oxygene, CHF3 for SiN, SiO and SiC deposition

PECVD with Ar, Methane, Helium, N2, Silane, Nitrous Oxide, SF6 for SiN, SiO and SiC deposition

RIE with Ar, CHF3, CF4, O2, SF6, N

Polymer asher

The Vapor Deposition machine for deposition of following metals: Cr, Au, Ni, Al, Cu,Ti

Sputtering and PVD

Maximum size 8"

Structures printed circuit boards. Drills contact holes.

The 600+ is a high-performance potentiostat/galvanostat/ZRA particularly suitable for applications in physical electrochemistry, sensors, coatings, and corrosion.

Resist coating wafer

Wafer photoresis spin coater for SU8 Up to 4000 rpm

Wafer photoresist spin coater Up to 8000 rpm AZ 9260, AZ15,125 (n)XT, map-1215

Coating thickness, roughness

Measurement of Layer Thickness and Surface Profile Range from 10 nm up to 1 mm Stylus Force up to 0,09 mg

Ellipsometry for 300 nm – 1700 nm

Wire bonder

3x Programmable Ramp Hotplate

Annealing in quartz tube, Vacuum, N2 Annealing up to ~500°C